System

Description

EEW

Viscosity

Applications

Key Advantages

JRE-187

BPA based epoxy resin

184-190

11000-14000

• General purpose liquid epoxy resin

• Excellent adhesion, mechanical, thermal and chemical properties

JRE-186

BPA based epoxy resin

180-190

8000-11000

• General purpose liquid epoxy resin

• Slightly low viscosity compared to JRE-187

HSC 4110

C-12-C-14 alcohol mono glycidyl ether of epoxy

290-310

Max 10

• Epoxy flooring top coats

• Better non yellowing properties
• Enhancement in working time

HSC 4150

O-cresol mono glycidyl ether of epoxy

165-190

Max 20

• Adhesives
• Castings
• Composites

• Reducing the viscosity
• Retention of mechanical properties

HSC JRE-100

Cycloaliphatic modified epoxy resin

160-175

500-1000

• Outdoor electrical castings

• Excellent weather resistance
• Low viscosity~1000cPs
• Low HyCl

HSC EPN 2202

Novolak Epoxy

176-181

30000-4000 @ 52°C

• Thermal stable adhesive
• High chemical resistance coatings

• High crosslink polymer
• High chemical resistance
• High thermal resistance

System

Description

AHEW

Viscosity

Applications

Key Advantages

HSC 8210

Aliphatic Amine

23

Max 20

• General purpose quick curing hardener

• Fast cure
• Superior mechanical, thermal and chemical properties

HSC 8221

Cycloaliphatic Amine

46

Max 20

• Composites
• Civil and coatings

• Superior weathering properties
• Superior mechanical and excellent thermal properties

HSC 9220

Cycloaliphatic Amine Adduct

68

80-250

• Civil top coat

• Excellent wetting
• Low viscosity assists high filler loading compared to conventional available

HSC 9221

Cycloaliphatic Amine Adduct

109

350-400

• Civil top coat
• Potable water coating

• Excellent wetting
• High gloss
• Superior adhesion to substrate

System

Description

Mix Ratio

Pot life

Applications

Key Advantages

HSC 7100/ HSC 8210

Epoxy general purpose quick curing medium viscosity adhesive

100:10

25-35

• Abrasive bonding
• Flap wheels bonding
• Metal to metal/non-metal bonding
• Electronic component bonding

• Good adhesive strength
• Good mechanical properties
• Quick curing adhesive

HSC 7100/ HSC 8230

Epoxy general purpose moderate curing adhesive

100:50

60-90

• Abrasive bonding
• Flap wheels bonding
• Metal to metal/non-metal bonding

• Superior adhesive strength
• Good mechanical properties
• Slow curing adhesive

HSC 7100/   HSC 8100

Epoxy general purpose moderate curing non-thixotropic adhesive

100:80

45-60

• Metal to metal/non-metal bonding
• Glass bonding
• Bangle Adhesive

• Superior Clarity
• Moderate curing adhesive

HSC 7110/ HSC 8100

Epoxy general purpose slow curing thixotropic adhesive of very high strength

100:80

70-90

• Marble joint applications
• Metal to metal/non-metal bonding
• Bangle adhesive
• Furniture industry
• Routine maintenance

• Versatile adhesive
• High shear strength
• Very low shrinkage
• Good chemical resistance
• Moderate curing adhesive

HSC 7160/ HSC 8210

Modified low viscosity quick curing adhesive

100:10

60-80

• General purpose bonding
• Automotive filter bonding
• Brush bonding

• Good adhesive strength
• Good mechanical properties
• Moderate curing

HSC 7760/ HSC 8210

Modified low viscosity quick curing moulding compound

100:10

80-100

• Casting of moulds and tools

• Superior filler wetting
• Good mechanical strength
• Good thermal & chemical resistance

HSC 7523/ HSC 9510

Pre-filled epoxy system for quick setting putty applications

100:25

10-15

• Crack filling/ final finishing of various epoxy application sites
• Crack filling of electrical and electronic components

• Neutral color
• Fast setting
• Can be applied on vertical cladding

HSC SB-150K

Adhesive for battery case applications

100:40

30 min

• ABS to plastic bonding
• Adhesives for electronic manufacturing

• Excellent adhesive strength for ABS, Plastic and FRP
• BPA+ Vinyl resin structured adhesive

HSC SM-100B

Molding compound for battery terminal

100:40

30 min

• Molding resin for plastics viz. PVC, ABS, PC, Rubber with excellent adhesion

• Excellent acid and alkali resistance
• Temperature resistance of -30°C to 94°C

System

Description

Mix Ratio

Mix Viscosity

Applications

Key Advantages

HSC 7450/ HSC 8231

Modified epoxy resin of low viscosity and EEW ~190 with low very low viscosity polyamide hardener

100:50

500-600

-Flooring primers
-Injection grouting of old civil structures

-Working life of 100g mix is around 2 hours
-Low exotherm
-Superior mechanical properties

HSC 7450/ HSC 8230

Modified epoxy resin of low viscosity and EEW ~190 with medium viscosity polyamide hardener

100:50

1500-2500

-Flooring primers
-Screed/ mortar applications
-Foundation grouting of heavy machine

-Working life of 100g mix is around 1 hour
-Superior bond strength
-Good surface wetting
-Superior mechanical properties
-Good chemical resistance

HSC 7451/ HSC 8231

Modified epoxy resin of low viscosity and EEW ~210 with low very low viscosity polyamide hardener

100:50

700-800

-Flooring primers with improved toughness

-Working life of 100g mix is around 2 hours
-Similar properties as HSC7450/ HSC8231 system with increased toughness

HSC
7452/ HSC 8230

Modified epoxy resin of very low viiscosity and EEW~200 with medium viscosity polyamide hardener

100:50

1500-2500

-Flooring primers
-Screed and mortar applications
-Foundation grouting of heavy machine and equipment

-Working life of 100g mix is around 1 hour
-Similar properties as HSC7450/ HSC8230 system with slow curing and increased toughness

HSC 7453/ HSC 8233

Low viscosity epoxy resin with same degree of chemical resistance as basic epoxy resin with coal tar modified hardener

100:100

2000-5000

-Coal tar modified system for chemical and water protection of concrete structures, ETP tanks, sewage treatment plants etc.

• Working life of 100g mix is around 1 hours
• Superior corrosion resistance
• Superior chemical resistance

HSC 7400/ HSC 8230

Unmodified epoxy resin of medium viscosity and EEW~185 with medium viscosity poyamide hardener

100:50

10000-15000

• Foundation grouting of heavy machine and equipment
• Primer coating for concrete and metal structures

• Working life of 100g mix is around 1 hour
• Good substrate wetting
• Good chemical resistance

HSC 7454/ HSC 8232

Economic version of HSC 7450 with low viscosity polyamide hardener

100:50

500-600

- Flooring primers
- Injection grouting of old civil structures

• Quick curing and less toughness compared to HSC 7450/ HSC 8231

HSC 7454/ HSC 8230

Economic version of HSC 7450 with medium viscosity polyamide hardener

100:50

1500-2500

-Flooring primers
-Screed/ mortar applications

• Quick curing and less toughness compared to HSC 7450/ HSC 8230

System

Description

Mix Ratio

Mix Viscosity

Applications

Key Advantages

HSC 7600/ HSC 8210

Quick curing medium viscosity epoxy system for hand lay-up application

100:10

1500-2500

• Industrial & Structural composites
• General purpose laminates

• Excellent fiber wetting
• Negligible shrinkage
• Superior mechanical properties

HSC 7660/ HSC 8210

Slow reactive low viscosity epoxy system for hand lay-up application

100:10

800-1000

• Industrial & Structural composites
• General purpose laminates

• Better fibre wetting compared to HSC7600/HSC 8210
• Good mechanical properties

HSC 7660/ HSC 8231

Slow reactive low viscosity good toughness epoxy system for hand lay-up application

100:50

1000-1500

• Lamination of sports goods
• FRP gratings
• Elevating structures for solar panels

• Long pot life
• Good mechanical properties
• Improved toughness

HSC 7600/ HSC 8570/ HSC 5510

Epoxy system for pultrusion with         Tg~ 100°C

100:100:1

3000-4000

• Filament winding
• Pultrusion of structure & industrial composites like electrical laminates

• Elevated temperature cure
• Superior mechanical properties

HSC 7200/ HSC 8575/ HSC 5510

Epoxy system for pultrusion with         Tg~ 120°C

100:85:1

1000-1500

• Filament winding
• Pultrusion of structure & industrial composites like electrical laminates

• Elevated temperature cure
• Superior mechanical properties
• High Tg
• Low initial mix viscosity
• High working time
• Good electrical properties

HSC 7251/ HSC 8573

Good toughness low viscosity epoxy system for pultrusion

100:90

500-1000

• FRP profiles and pipes for various electrical and chemical applications

• Elevated temperature cure
• Tg ~ 110°C
• Superior mechanical properties

HSC 7251/ HSC 8221

RT cure long pot life system for filament winding/ hand lay-up

100:20

500-1000

• FRP profiles using filament winding / hand lay-up technique

• Room temperature cure
• Working time of 120 min
• Superior mechanical properties
• Tg achievement up-to 100°C with varied curing

HSC 7250/ HSC 8220

RT cure long pot life system for filament winding/ hand lay-up

100:25

200-600

• FRP profiles using filament winding / hand lay-up technique

• Room temperature cure
• Working time of 300 min
• Superior mechanical properties
• Tg achievement up-to 80°C with varied curing

HSC 7600/ HSC 8760

Epoxy resin with solid aromatic amine hardener for good chemical resistance

100:27

800-1000

• General purpose laminates by pre-pegs and pultrusion for industrial and structural composites

• Long pot life
• Elevated temperature cure
• High glass transition temperature
• Good dielectric properties

System

Description

Mix Ratio

Mix Viscosity

Applications

Key Advantages

HSC 7560/ HSC 8210

Cold quick setting low viscosity epoxy system for electrical insulation parts

100:10

800-1000

• Potting and     encapsulation of low
  voltage components like CDI, Flashers,
  ignition & charging coils, igniters, rectifiers & capacitors

• RT cure with high electrical strength around 20KV/mm
• Low viscosity assist in high filler loading
• Superior mechanical and thermal properties

HSC 7250/ HSC 8210

Cold slow setting very low viscosity epoxy system for electrical insulation parts

100:10

400-500

• Encapsulation and potting of low voltage electrical & electronic components

• Electrical strength of around 18KV/mm
• Superior dielectric properties
• Low viscosity assist in high filler loading

HSC 7550/ HSC 8570/ HSC 6510/ HSC 5510/ Filler

Hot setting epoxy system for electrical insulation parts

100:100:10:1
With 300-400 parts filler

1500-2000 @ 80°C

• Indoor insulators for medium/   high voltage like post
  insulators & bushings
• Instrument & dry type transformers
• Switch gears
• Processed using both Conventional vacuum casting and Automatic pressure gelation

• Superior electrical,  mechanical &  thermal endurance properties
• Class F

HSC HOC-301

Prefilled Epoxy for indoor casting hot curing

100:20

• Bushing
• Insulator
• Switchgear

• Superior electrical insulation
• Excellent mechanical strength
• High durability

HSC HOC-701

Prefilled cycloaliphatic epoxy for outdoor casting hot curing

100:100

• Housing
• Switchgear
• S-LBS, Eco-LBS
• GIS Spacer

• Excellent weatherproofing

     (Pass UV B~1000h)

• Superior electrical insulation
• Excellent mechanical strength
• High durability
• Improved tracking resistance

HSC HOC-603

Prefilled epoxy for indoor casting hot curing

100:100

• High voltage transformers
• Bushings
• Brackets

• Excellent electrical insulation
• Superior dimensional stability
• Improved durability

HSC HOC-303G

Epoxy for indoor casting hot curing

100:20

• Current transformers
• Potential transformers
• Metering outfit

• Low viscosity
• Excellent impregnation

HSC HOC-153

Outdoor heavy electric machinery molding resin hot curing

100:100

• System for outdoor heavy electric machinery product molding
• SF6 gas substitutes: SF6 free high voltage switchgear
• High voltage transformer, bushing, housing, bracket

• Flame retardant FV1
• Weatherproof (100h UV B)
•  Low heat shrinkage
• Superior mechanical properties

HSC JCM-125

LED potting systems RT curing

100:25

• LED surge protectors

• Superior electrical properties
• Excellent heat dissipation
• Low exotherm

Grade

RI

Functionality

Viscosity
(cPs @ 25°C)

Features

Applications

HSC SEA-187

1.558

2

5000 @ 60°C

BPA Epoxy

Paint & Coatings, Semiconductor & Adhesives

HSC SEA-4125

1.533

2

2500 @ 50°C

BPA PO Epoxy

Paint & Coatings, Semiconductor & Adhesives

HSC SUO-2001

1.573

2

2000

BPF Epoxy

Display, Semiconductor & Adhesives

Grade

RI

Functionality

Viscosity
(cPs @ 25°C)

Tg (°C)

Features

Applications

HSC SU
O-300

1.491

3

30000

7

Aliphatic urethane Good adhesion to PC film

Display, Paint & Coatings, Semiconductor & Adhesives

HSC SUO-7301

1.478

2

7000

19

Aliphatic urethane

Display, Paint & Coatings, Semiconductor & Adhesives

HSC SUO-M2000

1.468

2

35000

-53

Aliphatic urethane

Display, Paint & Coatings, Semiconductor & Adhesives

HSC SUO-7620

1.492

6

35000

Aliphatic urethane (Flexibility)

Display, Paint & Coatings, Semiconductor & Adhesives

HSC SUO-7630

1.495

6

2000 @ 60°C

Aliphatic urethane
(Alcohol-soluble)

Display, Paint & Coatings, Semiconductor & Adhesives